Pros and Cons Of Ion Beam Sputtering
Ion beam sputtering or also known as ion beam deposition is a thin film deposition technology that utilizes source of ion in order to deposit a sputtering target to a substrate to generate the highest quality of films with focus and precision. IBS is also more accurate compared to other PVD technologies. The accuracy allows the tool to have control over the substrate thickness. IBS is one of the trusted deposition technologies that expert use and recommend as well. Here are some of the advantages and disadvantages of ion beam sputtering.
One of the best advantages of ion beam sputtering is that it can be applied or coated to any materials. This is possible because there is smaller difference in sputtering characteristics compared to the evaporation characteristics. IBS can even be applied in materials with high melting point. It is also easy to form a film having the same ratio as the target when it comes to target compound materials and alloy
Another benefit of IBS or ion beam sputtering is its high energy. Sputter coating in making molecules is using momentum exchange and atoms become the gas phase. The average energy of the sputtering is 10eV. This is a hundred times higher than vacuum evaporated particles. With its high-energy characteristic, the film will be made quality and firmly bonded to the substrate.
Ion beam sputtering is also scanned, précised and focused. The characteristics of the ion beam will still be marinated while the substrate materials and target are changing. Also, the current and energy of the ion beam can also be controlled independently. The precision of ion beam makes its very suitable as a research method for thin film disposition.
The resulting coating is stable, dense and uniform. As a result, it can effectively adhere to the substrate. This is possible because of the inherent collimation single energy of ion beam sputtering. As a result, the films created using IBM will be durable and stable.
Good uniformity is another benefit or advantage of ion beam sputtering. Generally, sputter coating’s incident ions are obtained by gas discharge method. The working pressure of this process is between 10-2Pa-10Oa. Since putter ions usually collide with gas molecules in the vacuum chamber, the motion direction randomly deviates from the original direction. As a result, the area becomes more uniform than vacuum coating.
Basically, the main advantage of IBS is that small target area of the bombardment and the low disposition rate. In addition, IBS is also not ideal for depositing uniform thickness large area film. The cost of the equipment operating is relatively high because the sputtering tool is quite complicated.
Overall, knowing these advantages and disadvantages of ion beam sputtering is necessary in the field or area of film deposition technology. When creating a film, it is important to use the right tools so you can create a high quality and reliable one. For more information, you can visit https://www.evaporatedcoatings.com/ion-beam-sputtering-ibs-coatings/